This subcommittee is developing additional resources, such as white papers, technical presentations and webinars, to supplement IPC-WP-023 on weak microvia interfaces. In addition, subject matter experts with companies from the printed board supply chain have joined this subcommittee to share data and experiences about microvia interfaces and to strategize industry solutions to overcome this problem.
IPC V-TSL-MVIA is an invitation-only subcommittee at this point, limited to those with direct experience with the problem. Email the staff liaison or chairs for more information or if your company would like to participate. At a later date, a different, more open structure is anticipated.
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