Group Description

This subcommittee is responsible for developing IPC-7092 Design and Assembly Process Implementation for Embedded Components. This document describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board.

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Wed, Apr 4 2018
info | D-55 APEX EXPO 2018 Minutes (16K)
D-55 Embedded Devices Process Implementation Subcommittee
Fri, Feb 9 2018
info | D-55 APEX EXPO 2018 Agenda (24K)
D-55 Embedded Devices Process Implementation Subcommittee
Mon, Sep 11 2017
info | Agenda D-55 Embedded Components -- 2017 Fall Meeting -- September 17, 2017 (13K)
D-55 Embedded Devices Process Implementation Subcommittee
Tue, Feb 21 2017
info | D-55 APEX EXPO 2017 Meeting Minutes (14K)
D-55 Embedded Devices Process Implementation Subcommittee

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