Group Description

This subcommittee is responsible for developing and maintaining test protocols for assessing the reliability and material/design robustness of test coupons/vehicles through the use of assembly reflow simulation profiles. The test will aid in establishing the acceptability of a printed board exposed to multiple thermal excursions in both tin-lead and lead-free processing environments.

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Mon, Jan 30 2017
info | IPC-TM-650 Method 2.6.27A Final Draft for Industry Review - January 2017 (195K)
D-32 Thermal Stress Test Methodology Subcommittee

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