Group Description

This subcommittee is responsible for the management of IPC-7091, Design and Assembly Process Implementation of 3D Components. This document describes design and assembly challenges and ways to address them and focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

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Mon, Jan 29 2018
info | B-11 - 2018 - APEX EXPO Agenda (24K)
B-11 3-D Electronic Packages Subcommittee
Mon, Sep 11 2017
info | B-11 - 2017 Fall Meeting Agenda (1MB)
B-11 3-D Electronic Packages Subcommittee
Fri, Feb 3 2017
info | B-11 - 2017 - APEX EXPO Agenda (21K)
B-11 3-D Electronic Packages Subcommittee
Thu, Sep 22 2016
info | B-11 Agenda-sent.docx (23K)
B-11 3-D Electronic Packages Subcommittee

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