Group Description

During normal SMT reflow, tin terminations are converted to tin-lead, wherever they are wetted. Certain component types, under certain conditions, will always have their entire tin surface converted to tin-lead, with such components being termed as “self-mitigating” and can be used without further mitigation, thereby saving cost. The output of this task group will be an IPC/PERM White Paper that can be revised as additional testing.

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