This task group is responsible for the maintenance and development of specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures which are based on the guidelines furnished in IPC-9701 User Guide for the IPC-TM-650, method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing.
The documents which this group maintains are: IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects, -9703 Mechanical Shock Test Guidelines for Solder Joint Reliability, -9704 Printed Wiring Board Strain Gage Test Guidelines, -9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection, -9707 Spherical Bend Test Method for Characterization of Board Level Interconnects, IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering, and IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test.
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