Group Description

This task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in the electronic assembly. In addition, there are recommendations for void acceptability and defect analysis.

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Thu, Apr 19 2018
info | 5-21f/5-22h Joint Task Group Meeting Minutes -- 04192018 (18K)
5-21F Ball Grid Array Task Group
Tue, Mar 6 2018
info | 5-21f APEX EXPO 2018 Meeting Minutes (501K)
5-21F Ball Grid Array Task Group
Mon, Feb 12 2018
info | 5-21f APEX EXPO 2018 Agenda (148K)
5-21F Ball Grid Array Task Group
Tue, Nov 21 2017
info | 5-21f meeting minutes 11-08-2017 (15K)
5-21F Ball Grid Array Task Group

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