Group Description

This subcommittee is responsible for developing IPC-7092 Design and Assembly Process Implementation for Embedded Components. This document describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board.

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Tue, Feb 21 2017
info | D-55 APEX EXPO 2017 Meeting Minutes (14K)
D-55 Embedded Devices Process Implementation Subcommittee
Tue, Jan 24 2017
info | D-55 2017 IPC APEX EXPO Meeting Agenda (24K)
D-55 Embedded Devices Process Implementation Subcommittee
Tue, Jan 17 2017
info | Proposed Scope for New IPC Embedded Specification (13K)
D-55 Embedded Devices Process Implementation Subcommittee
Wed, Dec 7 2016
info | D-55 Meeting Minutes 12072016 (14K)
D-55 Embedded Devices Process Implementation Subcommittee

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