Group Description

This subcommittee is responsible for standards for 2.5D and 3D packages, applications, processing, assembly, and design rules.

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view all Recent Shared Documents (4)

Fri, Feb 3 2017
info | B-11 - 2017 - APEX EXPO Agenda (21K)
B-11 3-D Electronic Packages Subcommittee
Wed, Dec 14 2016
info | IPC-7091 FDIR Comment Resolutions -- 12142016 (48K)
B-11 3-D Electronic Packages Subcommittee
Thu, Oct 20 2016
info | IPC-7091 Comment Form FDIR 102016 (27K)
B-11 3-D Electronic Packages Subcommittee
info | IPC-7091 Final Draft for Industry Review -- 10202016 (3MB)
B-11 3-D Electronic Packages Subcommittee

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