Group Description

This task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components. They developed technical document IPC-SM-786 (Recommended Procedures for Handling of Moisture Sensitive Plastic IC Packages) to address this. Subsequently, they joined with JEDEC to develop replacements for IPC-SM-786 to reflect current technology. J-STD-020A, "Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices," and J-STD-033, "Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices," have been published, and will be updated by this task group.

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Wed, Aug 16 2017
info | J-STD-075A Final Draft for Industry Review (1MB)
B-10A Plastic Chip Carrier Cracking Task Group
Thu, Apr 6 2017
info | Final Draft for Industry Review (962K)
B-10A Plastic Chip Carrier Cracking Task Group

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