Group Description

This task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components. They developed technical document IPC-SM-786 (Recommended Procedures for Handling of Moisture Sensitive Plastic IC Packages) to address this. Subsequently, they joined with JEDEC to develop replacements for IPC-SM-786 to reflect current technology. J-STD-020A, "Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices," and J-STD-033, "Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices," have been published, and will be updated by this task group.

View All Upcoming Shared Events()

No publicly visible events found.

view all Recent Shared Documents (1)

Thu, Apr 6 2017
info | Final Draft for Industry Review (962K)
B-10A Plastic Chip Carrier Cracking Task Group

Recent Email (4)

Sorry, you do not have access to this group's mail archives.

View All Open Shared Ballots (0)

No open ballots found.