6-11 Printed Board Coplanarity Subcommittee
This subcommittee will develop a high-temperature printed board warpage measurement methodology focused primarily on component (land) areas. The goal is to align high-temperature printed board flatness to existing JEDEC SPP-024A (reflow flatness requirements for BGA packages) and JEDEC JESD22-B112 (high-temperature package warpage measurement methodology) which will enable a fully integrated specification for SMT optimization.
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