Group Description

This task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in the electronic assembly. In addition, there are recommendations for void acceptability and defect analysis.

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Fri, Sep 15 2017
info | IPC-7095D Final Draft for Industry Review (19MB)
5-21F Ball Grid Array Task Group
info | 5-21f 2017 Fall Meeting Agenda (23K)
5-21F Ball Grid Array Task Group
Fri, May 5 2017
info | 5-21f minutes 05052017 (15K)
5-21F Ball Grid Array Task Group
Fri, Apr 7 2017
info | 5-21f minutes 04072017 (16K)
5-21F Ball Grid Array Task Group

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